Hosted by: IEEE Toronto (WIE, Signals & Computational Intelligence, Measurement/Instrumentation-Robotics, Magnetics chapters), Computer Science Department of Ryerson University

Presented by: SimuTech Group – ANSYS Elite Channel partner

Contacts:

SimuTech Group: Mohsen Tayefeh – mtayefeh@simutechgroup.ca or 416.249.1471 Ext 244
IEEE Toronto:  Dr. Maryam Davoudpour – maryam.davoudpour@ieee.org

 

What:
Engineering the Internet of Things – Digital Twin Seminar

When:
Friday, April 28
9:00 AM - 4:00 PM ET


Where:
Ryerson University
George Vari Centre for Computing and Engineering
Room: ENG 288
245 Church Street
Toronto, Ontario M5B 2K3

Cost:
Free including lunch


Register:



Why attend?

High-tech–industry product development teams routinely use coupled multiphysics software to analyze the trade-offs among speed, bandwidth, signal integrity, power integrity, thermal performance and EMI/EMC.
 
The Internet of Things is a network of smart products, or “things”, that use embedded sensors, software, and electronics to communicate with each other over a network. The communication data can be analyzed by cloud based software to derive actionable information, leading to predictive and prescriptive outcomes.

In this seminar, the following topics will be discussed:

 
  • Engineering the Internet of Things
  • 5 Engineering Challenges for Smart Product Development
  • Case Study: Search and Rescue Drone-Satellite System
  • Signal Integrity/EMI/EMC, Human body, Federal Regulations
  • User experience – Wearable devices (Multiphysics Simulation)
  • Digital Twin – GE and ANSYS collaboration
  • Case Study: prescriptive maintenance case study
  • Lunch
  • RF Antenna placement
  • Step by step workshop – Antenna analysis
  • PCB design – Power Integrity
  • Thermal management (CFD)
  • Networking, Door prize/draw (Drone)

Engineering the Internet of Things – Digital Twin